Project ML-InkJet

Title
Development and implementation of multilayer ink-jet printing for flexible electronics
Period
April 1 2017 - May 31 2020
Grant
NCBiR
Consortium
Leader: University of Lodz (UL) prof. dr hab. Zbigniew Klusek
Partner: Electrotechnological Company QWERTY Ltd, M.Sc.,E.Eng Zbigniew Sieradzki
Summary
The Project’s main objective is to develop the innovative technology of the multilayered printing process using Ink-Jet technique for elastic electronics applications. With the close collaboration between scientific institution and industrial partner it will be possible to overcome the significant problems occurring nowadays in production processes. The planned project enables understanding of physical and chemical processes that take place on the boundaries of neighboring layers/phases in the multilayer printed electronic. This will lead to development and implementation of the technology which will be breakthrough of multilayer printing and bring improvement of current products and introduce completely new ones. Currently, production of multilayer electronic systems is performed by multi-step printing processes and vacuum evaporation of materials. This approach is complicated, multi-processed and do not allow precise control of capabilities of layers’ optimum adjustment. The breakthrough of this project is developing the innovative direct multilayer printing technology. For this purpose suitable inks containing respective functional materials will be designed and the technological process of connecting many layers in a single printing process with simultaneous controlling of the interface will be developed. The developed technology will allow for production (by printing) of the new range of devices, such as organic light emitting diodes, organic photovoltaic devices and sensors. With the nowadays technology such devices cannot be produced by printing with reaching the sufficient work efficiency. Additionally the proposed technology will allow for energy efficient combination process of the materials with various properties in order to achieve new functionalities. This will lead to development of new range of devices within the field of elastic electronics.